タイトルまたは説明

Layer count: Rigid PCB 2 - *4 + Layers; Rigid-flex PCB 1 - *0Layers
Panel Size(max): *1" x *4" for Rigid, 9.*5'' x *7.2'' for FPC
Materials: FR*4, roger, high-TG FR*4, halogen-free FR*4
Board thickness: 0.**6" to 0.**0"
Copper weight: Heavy copper PCB (6oz finished)
Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver,
gold fingers, carbon ink, OSP, peelable mask
Minimum finishing hole size:0.**6" Thru Hole (Finished Size) and 0.**4" Buried Via,
Hole Size Tolerance: ±0.*5mm(PTH); ±0.*5mm (NPTH)
Aspect ratio: *0:*1
Outline Dimension Tolerance: ±0.*3mm
Conductor Width Tolerance: ±0.*5mm or ±*0%of Original Artwork
Warp & Twist Ratio: 0.*0%
Insulation Resistance For E/T test: *0K Ω**0M Ω
Conductivity Resistance For E/T test: <*0 Ω
Voltage For E/T test: **0v maximum
Registration Tolerance Front/Back Image: 0.**5mm
Layer to Layer Registration: 0.**5mm
Board Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm);
Plugging hole Diameter with solder mask: 0.*0mm*0.*0mm
Minimum Solder dam Width: 0.1mm
Minimum Solder Mask Clearance: 0.*5mm
Solder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc)
Outline profile: punching, routing, punch and push back
Au thickness: 0.***2um*0.**2um(Hard Au); 0.***4um*0.**7um(Soft Au);
Ni thickness: 2.****7.**2um