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連絡先担当者 Hellen
Zhengzhou, Henan
Products Introduction
Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.
The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.
Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials
Juchuang Abrasive offers a variety of resin bonded grinding wheel,
Diameter range: φ****0mm, wheel thickness: 0.****0mm, grit size: *0/**-w0.5, offer the special wheels as customers requirements.
| 国: | China |
| モデル番号: | - |
| 离岸价格: | Get Latest Price |
| ロケーション: | - |
| 最低注文量の価格: | - |
| 最低注文量: | - |
| パッケージの詳細: | - |
| 納期: | - |
| 供給能力: | - |
| 支払いタイプ: | - |
| 製品グループ : | - |
