1W ceramic high thermal conductivity aluminum copper clad laminate UL passed

タイトルまたは説明

Feature:

UL NO.:E*****0

 thermal conductivity  1W/MK

Excellent breakdown voltage,

 

≥4KV

Excellent solder heat endurance,

High heat dissipation,electromagnetic shielding;

High mechanical strength;

Dimensional stability

Excellent processing performance

Dielectric layer :Ceramic

Thickness:

0.8mm ,1.0mm,1.2mm,1.5mm,2.0mm,3.0mm

Copper foil:

0.5oz,1oz,2oz,3oz,4oz,6oz

Size:***0****0mm,***0***0mm,**0****0mm,**0***0mm

Thermal conductivity:1W

Our service:

As one of the leading manufacturers of Al CCL, FR*4 CCL and insulation material, we take the quality as first factor.

We specially produces Metal Base Copper-Clad Laminates,and our products have been compiled series with all complete specifications.



Why choose us(our advantages)?

·         1. Our great passion and rational attitude make us highly efficient.

·         2. We have more than *0 years professional exprience in PCB material processing

·         3. Advanced equipments and professional engineers.

·         4. We are factories both in Shenzhen and Shanxi province with large warehouse and workshorp.

·         5. We offer you the high-quality product with competitive prices in hope for longterm cooperation.