2-layers PCBs

タイトルまたは説明

Technical parameters:

• Surface treatment: HASL (LF), immersion gold, flash gold, OSP, immersion tin, immersion silver, HASL, gold finger and selective nickelLaminates: CEM*3, PTFE, FR*4 (high-TG), metal base (AL, CU) and rogersLayers: *6 (maximum)Board size: *0 x *8 inches (maximum)Board thickness: 0.4 to 5.5mmMaximum copper thickness:
  • Inner layer: 4ozOuter layer: 5oz
  Track width: 4 mils or 0.1mm (minimum)Track space: 4 mils or 0.1mm (minimum)Hole size: 8 mils or 0.2mm (minimum)Laser hole size: 4 mils or 0.1mm (minimum)PTH wall thickness: 0.8mil or *0μmPTH diameter tolerance: ±3 mils or ±*6μmNPTH diameter tolerance: ±2 mils or ±*0μmAspect ratio: *0:1Impedance control: ±*0%Size: *0 x *0mm

• Base material: FR4Layer count: 2Board thickness: 1.6mmCopper thickness: 1ozSurface finish: immersion goldSolder mask color: greenSize: **4.*2 x **4.*8/2μp