タイトルまたは説明

   Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for key materials of semiconductor packaging( molding compound, solder ball, high-desity packaging substrate, conducting resin).

Features of products:

 1. material costs: low

 2. electronical conductivity: 5.*8 *0E7/Ohm

 3. thermal conductivity: *9.5KW/m2k 

 4. mechanical properties: good

 5. stability: stable

 6. solder joint: relatively better

Diameter(mm)

special order avaliable

Copper Wire Physical Properties:

Copper Bonding Wire Advantage:

1. Material costs: Low

2. Conductivity: 5.*8 *0 E7/Ohm Much thinner bonding wires during fine pitch packaging,  

                         excellent performance of fine pitch(much smaller bonding pad), improving  

                         current capacity and property of power regulating device.

3. Thermal conductivity: *9.5 KW/m2K

4. Mechanical properties: High mechanical property, larger tensile strength, better elongation,  

                                         excellent ball collar strength and higher arc stability.

5. Stability: Stable-slow inter metallic growth rate, improving mechanical stability  

                   and decreasing incremental resistance: moderate IMC growth enables  

                   bonding strength to be improved.

6. Solder joint: Significantly reduced inter-metallic growth rate of solder joints. Resistance  

                        reduced, heat production decreased, bonding reliability and device performance  

                        improved. As the new products have their inter-metallic growth rate, resistance  

                        and heat production lower than gold wire, the amount of resistance increase with  

                        time and aging rete also is reduced.