タイトルまたは説明

·       The device applies the spliced unit heat transfer blocks. The heat transfer blocks are sealed via teflon O-ring or inflated PTFE. The pressure spring is installed on the device as a whole to serve as the automatic compensation mechanism for thermal expansion.     
·        
·       [Technical characteristics]        
·       Material system:design pressure: 0.4MPa; design temperature: ******5℃;
·       Cooling system: design pressure: 0.4MPa; design temperature: ******5℃;
　　Specification of device: ****0m²; We can, as per users needs, design and manufacture device with pressure of 0.7MPa and temperature of **0℃, as well as heat exchanger of over **0m². ·       The device applies the spliced unit heat transfer blocks. The heat transfer blocks are sealed via teflon O-ring or inflated PTFE. The pressure spring is installed on the device as a whole to serve as the automatic compensation mechanism for thermal expansion.     
·        
·       [Technical characteristics]        
·       Material system:design pressure: 0.4MPa; design temperature: ******5℃;
·       Cooling system: design pressure: 0.4MPa; design temperature: ******5℃;
　　Specification of device: ****0m²; We can, as per users needs, design and manufacture device with pressure of 0.7MPa and temperature of **0℃, as well as heat exchanger of over **0m².