タイトルまたは説明

â… . Function/Features:
1. There are authority for supervisor and operator whose names can be changed/written/stored in, and the
serial number of the repaired PCB and the used heat profile can be stored as many as required.
2. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;
3. Automatic disassembly, automatic welding, automatic recycle of chips, completely liberating workers;
4. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is
more efficient, and the rework of the large chip is better;
5. Laser positioning, place the motherboard in one step;
6. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant
temperature, environmental protection and energy saving, and prevent small components/dust from
dropping;
7. External temperature measurement interfaces, convenient for temperature detection at any time,
temperature control is more accurate and reliable;
8. Touch screen operation, preset program, which can be used proficiently without professional technical
training, making chip repair very easy;
9. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;
*0. An external USB interface is used for software updates and various repair data to be imported into the
computer for analysis and storage;
*1. The large preheating temperature zone can satisfy the rework of the large motherboard of **0***0mm.
*1.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)

â…¡. Product parameter
Power Supply: AC**0V±*0ï¼… *0/*0Hz
Rated Power: ***0W
Top heater: ***0W
Bottom heater: ***0W
IR preheating area: ***0W (Germany heating tube, heating area of **0***0mm)
Operation mod: Fully automatically disassemble,suction,mounting and soldering
Basic configuration: Automatic feeding delivery system+HD digital
                                camera+Japanese Misumi suction rod system+Panasonic CCD
                                optical counterpoint system+HD digital display PC+Panasonic
                                servo+Panasonic PLC+an *-inch digital touchscreen +Grinding
                                level guide rail(Taiwan Hiwin)+Dalian Institute of Technology
                                **-channel temperature control system+ American Omega
                                Temperature measurement system+High fever efficiency and
                                heating tube+ Resistance to ***0 degree black crystal sand
                                glass
Chip feeding system: Automatic receiving, feeding, automatic induction (optional)
Temperature profile storage: ****0 groups
Optical CCD lens: Automatic stretch out and go back, which can be moved freely
                             before and after by rocker, to eliminate the "observation dead
                             corner" problem
Chip angel adjust:  Φ Angle can be **0° rotation, precision fine tuning fitting
                               suction nozzle
PCBA Positioning: Up and down intelligent positioning,bottom "*-point support"
                              with V-groove fixed PCB which can be adjusted freely in the
                              X-axis direction, with universal fixtures meanwhile
BGA position: Laser positioning to quickly find the vertical point of the upper
                       and lower temperature zone and the central point of BGA
Temperature control:K-type Sensor,Closed loop and 8~*0 segments for temperature
                                 controlling program
Temperature accuracy： ±1 ℃
Placement Accuracy： +/*0.*1mm
CCD system： A CCD HD digital camera, 6 million pixels(Industrial-class),
                       automatic optical zoom, laser positioning
Pressure sensor： Inductive pressure greater than 0.****0.**0g/c m² will initiate
                             collision pressure protection
Safety guard pressure sensor +emergency knob,double-guard.
Workbench fine-tuning： Back/front±*5mm,left/right±*5mm
PCB size： Max**0***0 mm Min *0×*0 mm
PCB thickness： 0.***5mm
BGA chip： 1x***5**5mm
Gas source： External gas source
BGA suction mode： Negative pressure vacuum suction, automatic induction release
                                   in place
BGA weight： ****0g (special specification customization)
Minimum chip spacing： 0.*5mm
External Temperature Sensor： 5 pcs（optional)
Machine type： Desktop table (optional)
Dimensions： L**0*W**0*H**0 mm
Net weight： **0kg