タイトルまたは説明

***** dimension:**0 * **0mm ***** thickness of inner layer:*****0um ***** thinckness of outer layer:*****0um ***** ring:0.*0mm ***** mask clearance:0.*5mm ***** mask cllearance:0.**5mm ***** tolerance:+/**0% ***** board thinckness:0.*5mm*3.5mm ***** precision:+/*0.1mm *0.Surface finished type:***** gold, ENIG, OSP(lead free compatible), Carton Ink, peelable S/M, HASL(lead free etc. *1.Products type:High precision , multi-layer, blind hole board, buryed hole board, high frequancy board, Aulminium Backed board *2.Base material:FR*4, ALUMINIUM-BLACKED BOARD, hALOGEN-FREE , lEAD-FREE COMPATIBLE, HIGHtG, hIGN cti, cem*1, cem*3 *3.Layers:***2layers *4:Inner layer corcuit:4/4mil ***** layer circiut width/spacing:4/4mil *6.Board thinkness:0.**1.6mm *7:Min.drill bit size:0.2mm Aspect ratio:8:1