タイトルまたは説明

We are a professional manufacturer of producing MBCCL (Aluminum base CCL ), the detailed information as below-mentioned, Aluminum Base Copper Clad Laminate YD-AL5 1. Thermal conductivity: **1.5 W/m. K 2. Thermal stress : **0℃2min YD-AL6 1. Thermal conductivity: 1.**2.2 W/m. K 2. Thermal stress : **8℃2min YD-AL7 1. Thermal conductivity: 2.**3.0 W/m. K 2. Thermal stress : **0℃2min Application : For hign powder LED lighting, power , LED TV industrysupply, laser printer motor etc^ Usual Size : **0mm***0mm , **0mm****0mm Circuit layer : Copper foil Dielectric layer : Fiberglass support & unsupport Aluminum base : grade****0 & ***3 & ***1 If you are interested in any, please contact us by e-mail. For more product information, please refer to our website .