タイトルまたは説明

1.     The machine uses high quality infrared heating device, strong penetration, the device is heated evenly;

2.     No need for dismantling welding fixture, you can desolder various components of ****0 mm;

3.     Equipped with **0 W preheating sol system, preheating zone area **0 mm x **0 mm;

4.     Tearing open welding or reworking BGA, SMD, CSP, LGA, QFP, PLCC and BGA plant ball, at the same time, reworking all kinds of extension socket belts and needle type socket (such as CPU socket and GAP socket);

5.     Fully meet the BGA desoldering/rework requirements of computer, laptop, electricity wander and other main board;

6.     Working table size: **0mm×**0mm;

7.     Power supply: AC**0V/***0W;

8.     Infrared lamp temperature: **0°C***0°C adjustable;

9.     Preheating zone temperature: *0°C***0°C adjustable;

*0.   Overall dimension: **0mm×**5mm×**0mm;

*1.   Weigh: 9.5kg.