タイトルまたは説明

Specifications: 1．Total power：4.2KW 2．Up heating power：**0W 3．Heating power of 3rd temperature area：**0W 4．Thermostat heating power：***0W 5．Power supply ：Single phase **0V/**0V *0/*0Hz 4.5KVA 6．Machine dimension：**0׵*0׶*0mm 7．Temperature control： high-precision K sensor 8．Positioning： V-groove for PCB positioning, Max PCB size **0׳*5mm 9．Weight： About *0kg Features: 1. Choose imported high-precision materials (temperature sensor, heater) to control the BGA desoldering & soldering procedures precisely. 2. There are three independent heating areas from top to bottom. the first and second temperature areas can control many groups & sections of temperature parameters at the same time. The third area preheats the PCB thoroughly to achieve the best welding effect. 3. Choose imported high-precision thermocouple to detect top/down temperature precisely. With a function of over-temperature protection. 4. Top & bottom temperature areas heat independently, A cross-flow fan cools rapidly to protect the PCB from deformation when welding. 5. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering. 6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB. 7. For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.