タイトルまたは説明

3U ceramic binder diamond wheel with high strength, good heat resistance, cutting edge, grinding efficiency, grinding process easily fever and congestion, small thermal control, the machining accuracy. With the resin-bonded diamond grinding wheel, diamond grinding wheel, it solved the resin grinding efficiency, low life of low, abrasive itself in the grinding process. Ceramic grinding stones binder appear immediately in many countries are widely used in semiconductor wafer (silicon and solar wafers), diamond, diamond, diamond tools, cubicborazin, tungsten carbide), (new engineering structure ceramic, stone, crystal, rare earth materials (magnetic materials) jof hard brittle materials, mechanical processing and achieved good economic benefit. Wheel specifications: Size: D T H X **0ױ0׳2ױ0 **5ױ0׳2ױ0 **0ױ0׳2ױ0 **0ױ0׳2ױ2 **0ױ0׳2ױ0 **0ױ0׳2ױ2 **0ױ0׳2ױ4 **5ױ0׳2ױ0 **5ױ0׳2ײ0 **5ױ2׳2ױ4 we can also provide other shapes accroding to your requirement.