タイトルまたは説明

 
Profile for the encapsulating technology -COA

COA is the latest encapsulating method which is based on COB, and decreased the resistance of heat at a large extent.
 

COB technology applied in LED encapsulating area is developed recent years. The former LED products encapsulated is lack of lumen and easy damaged. With the new innovation of raw materials and technology, the stabilization of COB has improved, and reaches the level of LED SMD in luminous efficiency, especially for our COA.

The low resistance of heat brings lower light failure, that’s why our COA is unique. The LED Chips of COA encapsulating is installed on Aluminum plate which makes the heat produced by chips can pass to the driver quickly, and it’s really efficient for the release of heat.

For more details please contact:
crellum sales(at) g m a i l . c o m
crellum_madeline(at) m s n . c n