タイトルまたは説明

Specifications

Conductive IXPE foam
1. Thickness ranging from 0.5mm to *0mm(single layer) ,also we can laminated foam with thickness up to *0mm.
2. Width is maximum (***0mm).
3. Length is custom-made.

Specifications:

Conductive IXPE foam is produced by compounding PE with some special padding and foaming material, then cross linked by foaming.

Conductive  IXPE foam is produced by compounding PE with some special padding and foaming material, then cross linked by foaming. The conductivity IXPE foam is a hi-tech ESD product which has very good anti-static property, it is an ideal packing material for optoelectronic devices and microelectronics devices, integrated circuit, printed circuit board, communications, military products etc.

Conductive IXPE foam

1. Thickness ranging from 0.5mm to *0mm
2. Width is maximum (***0mm).
3. Length is custom-made.

We are manufacturer of PE foam. Serious buyer please feel free to contact me by email or telephone.

Technical Index: 

Features:
1.excellent anti-static performance, surface resistivity and volume resistivity is very stable, , at the same time, according to the customer requirement between adjusted
2.Excellent ESD effect and long term anti-static function.
3.with anti-static properties in not affect by environment or dry humidity
4.environmental protection, non-toxic, no odor
5.shockproof
6.good performance: Cutting, adhesive processed into customer requirements of various shapes
*5 IXPETechnical parameters of *0kg/m3 conductivity IXPE foam

7.High temperature resistance: EPE,IXPE resists a maximum temperature of **0°C.

8.Heat insulation, sound insulation, abrasion resistance; hard to lose and consume.

9.Non-chemical corrosion :  free chemical corrosion to the electronic devices and the packing materials.

*0.Superior buffering and cushioning performance: independent and meticulous closed cell.

Use and applications:

1.The use of the aforementioned components, boards, modules packages, electronics, telecommunications 

industry:

2.Applications in aviation, aerospace, communications, military ordnance and chemical industry.

3.Advantage:

1).It is an ideal substitute of traditional packaging materials. compared with traditional hollow board, conductive IXPE foam board is not only flexible and buffering,but also 

nontraumatic to electric devices and hands, while traditional hollow board is very easy to scratch electronic 

devices and hand in the process of use. The most important thing is that IXPE foam’s life is as several times 

longer as hollow boards.Compounded with antistatic, buffering and circulating properties, conductive IXPE 

foam trays for Hard Disks, Cell phones, Motherboards and Memory Bar have irreplaceable advantages to 

the traditional injection molding trays, which make sure the maximum protection to those devices when 

circulating.

2).Best service to you and delivery on time.

 Certificate authentication:

We complied with SGS, ROHS ,ISO***1etc.international standards.