タイトルまたは説明

In PCB manufacture industry, the layer of chemical plating usually is thickened through an acid copper plating process. Furthermore, throwing power and covering power of the bath are sensitive to organic impurities and various metal impurities. It is possible to avoid taking them into the bath if the copper sulfate is high purity. Therefore, problems such as pits, marks, darkness and mist become easy to forestall in order to guarantee a well-proportioned surface and plating capacity to deep and small holes. Moreover, it helps to improve the tractility of the board and the strength for resisting haul. Composition(%): purity: *9 (min.) Cu: *5.*5 As: 0.**2 (max.) Hg: 0.***1 (max.) Fe: 0.**6 Zn: 0.***2 Cl: 0.**3 Pb: 0.***2 Al: 0.**1 (max.) Ni: 0.**1 (max.) PH: 3.5 - 4.5