CP5 High Precision Automatic Solder Paste Printer

タイトルまたは説明

Wide compatibility for PCB dimensions from *0mm x *0mm to **0mm x **0mm and PCB thickness from 0.6mm to 6mm.
High printing resolution:
High positional accuracy, repeated positioning accuracy ±0.*1mm; printing accuracy 0.**5mm
Support glue printing.
Automatic control improves production efficiency, quality control and saves production cost:
Automatic PCB alignment
Squeegee pressure adjustable
Automatic printing
Automatic stencil cleaning (dry-type and wet-type)
Adopt company independently developed suspended print head with automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.
Programmable PCB lifting platform ensure the PCB to a proper height
Upward and downward visual positioning.
Built-in image processing system
Applicable pitches of Components
SMT Components such as resistors, capacitors, inductors, diode and triode: ****5, ***1, ***2, ***3, ***5, ***6 and other specifications
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm
Printing size：*0mm x *0mm ~**0 mm x **0 mm
PCB Thickness：0.6 mm ~ 6 mm
FPC Thickness：less than 0.6 mm (excluding jig) 
Applicable PCB types
Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products.


Specification
* The following data is obtained under ambient temperature of *5 ℃ and humidity of *0%
            Items ã€€ ã€€ã€€               Parameter
Repeat Position Accuracy ã€€±0.*1mm(test data and method can be provided)
Printing Accuracy ã€€±0.**5mm(test data and method can be provided)
Cycle Time ã€€ Screen Stencil Size/Min ã€€**0mm X **0mm
Screen Stencil Size/Max ã€€**7mm X **7mm
Screen Stencil Size/Thickness ã€€*0mm ~ *0mm
PCB Size/Min ã€€*0X*0mm
PCB Size/Max ã€€**0X**0mm
PCB Thickness ã€€0.6~6mm
PCB Warpage Ratio ã€€ï¼œ1%（Based on diagonal length）
Bottom of Board Size ã€€*0mm
Edge of Board Size ã€€3mm
Transport Height ã€€**0±*0mm
Transport Direction ã€€Left-Right; Right-Left; Left-Left; Right-Right
Transport Speed ã€€*******0mm/sec Programmable
Board Location Support System Magnetic pin/Side support block/Flexible automatic pin（optional）
 Clamping System Elastic side clamping/ Elastic Z-direction tabletting (optional, but not suggested)
Print head ã€€Direct-connected motor control of the squeegee pressure
Squeegee Speed  ã€€*0~**0mm/sec Programmable
Squeegee Pressure ã€€***5kg programmable
Squeegee Angle ã€€*0°(Standard)/*5°/*5°
Squeegee Type ã€€Steel squeegee (standard), rubber squeegee, other types of squeegee customizable.
Stencil Separation Speed ã€€0.*1~*0mm/sec Programmable
Cleaning Method ã€€Dry-type, wet-type ( Programmable combination of the two cleaning methods）
Table Adjustment Range ã€€X: ±4mm;Y:±6mm;θ:±2°
Type of Image Fiducial Mark ã€€Standard geometry shape of fiducial mark, bonding pad / stencil hole
Camera System ã€€Single digital camera with upward/downward vision system
Air Pressure ã€€4~6Kg/cm2
Air Consumption ã€€Approx. 0.*7m3 /min
Control Method ã€€PC Control
Power Supply ã€€AC:**0±*0%,*0/*0HZ 1Φ 1.5KW
Machine Dimensions ã€€***0mm(L) x ***0mm(W) x ***0(H)mm (excluding the height of indicating lighthouse)
Weight ã€€Approx:***0Kg
Operation Temperature ã€€**0°C ~ **5°C
Operation Humidity ã€€*0%~*0%