离岸价格
Get Latest Price|
20 Piece Minimum Order
国:
China
モデル番号:
DB118
离岸价格:
ロケーション:
-
最低注文量の価格:
-
最低注文量:
20 Piece
パッケージの詳細:
-
納期:
-
供給能力:
-
支払いタイプ:
-
製品グループ :
連絡先担当者 Ms. Docbond
628Jiushui East Road Laoshan District, Qingdao, Shandong
DB**8
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip
| 国: | China |
| モデル番号: | DB118 |
| 离岸价格: | Get Latest Price |
| ロケーション: | - |
| 最低注文量の価格: | - |
| 最低注文量: | 20 Piece |
| パッケージの詳細: | - |
| 納期: | - |
| 供給能力: | - |
| 支払いタイプ: | - |
| 製品グループ : | Electronic glue |
