タイトルまたは説明

Key Specifications/Special Features:
Base materials: high-temperature FR4/FR5, free halogen FR4, aluminum based, polyamide, Rogers, argon and other Teflon/PTFE
Layers: 1 to *2 layers standard PCB
Blind via and buried via board
Finishing: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard/soft gold, plating tin, immersion silver, immersion tin, electrolysis nickel and immersion gold
Minimum track space: 4/4 mils, 3 mils partial allowed
Maximum size: 1,**0 x 1,**0mm
Minimum size: 3 x 3mm
Surface copper thickness:
Maximum: 6/6oz
Minimum: 0.5/0.5oz
Hard gold thickness: *0u-inch maximum
Maximum board thickness: 6.0mm
Payment Details:
Payment Terms:
Telegraphic Transfer (TT,T/T)