FOG/FOB Bonding M/C

タイトルまたは説明

Application: The machine is used for bonding FPC, COF, TAB to various LCD panels and PCB. Key Feature: A. Double cylinders of SUNSOM pressure system can eliminate self-grativity of bond head. Minimum pressure accuracy is 0.1 kg. B. High strength and high precision aluminium of LCD table avoid distortion, dislocation and clearance. C. Three circuit of bond head, adjustable to mass-production, manual mode and testing mode, solve the inconvenience of up-down movement. D.Stepping memory system and auto-location solve the inconvenience of table movement. E. Imported vision system, controlling system and temperature system. Basic Parameter Voltage:AC**0V ****0HZ Operation Mode:7" interface Rating Power:1.5kw(constant heat) 4kw (pulseheat) LCD Table:Servo memory and auto location Pressure:0.**0.8Mpa TAB Fixture:Micrometer adjust X-Y-θ Bond Head : *0mm(constant heat) *0mm(pulse heat) Thermocouple:K type Rolliing Mode:Auto Program Control:PLC and servo controller Vision system:Two C/C CCD Heat Mode:Constant heat and pulse heat Weight:**0kg Dimension:L***0x W***0 x H***5mm