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連絡先担当者 luo
Foshan, Guangdong
| Items | Specifications |
| Material | aluminum base, copper base, FR*4, CEM*1 |
| Finish Board Thickness | 0.2mm*5.0 mm (8mil***7mil) |
| Board thickness tolerance | ±0.1mm |
| Copper Thickness | H/0 oz, 1/0 oz, 2/0 oz, 3/0 oz; H/H oz, 1/1 oz, 2/2 oz, 3/3 oz |
| Numbr of Layer | single-side LED PCB, double sides LED PCB |
| Max finished Size | ***0mm***0mm |
| Surface Finish | HASL(free lead), ENIG(Electroless nickel immersion gold), immersion silver, OSP |
| Thermal conductivity | 0.6 0.8 1.0 2.0 3.0 4.0 5.0 |
| Min line width | 0.2mm(8mil) |
| Min line spacing | 0.2mm(8mil) |
| Min hole diameter | 0.2mm |
| Min pad size | 1.2mm |
| Insulating layer thickness | *0 *5 **0 **5 **0 (μm) |
| Solder Mask Color | White/Green/Black/Matte Black/Red/Golden Yellow |
| Letter Color | White/Black/Green |
| Hole position tolerance | ±0.*5mm |
| Metallic hole diameter tolerance | ±0.**6mm |
| Twist and bend | ≤0.7% |
| Outline Tolerance | ±0.1mm/4mil (CNC routing); ±0.*5mm/6mil (tooling punching) |
| Shaping | V-cut, tooling punching, CNC routing, |
| Solder strength | >6H |
| Thermal Shock | **0°C *0Second 3times |
| Flame retardant | *4V*0 |
| Testing | **0% computer open/short circuit test, Impedance test, Thermal shock Test, Solderability Test, metallographic microsection analysis |
| File format | gerber, protel, power PCB, PADS***7, PCB doc, Auto CAD, sample |
| 国: | China |
| モデル番号: | - |
| 离岸价格: | Get Latest Price |
| ロケーション: | - |
| 最低注文量の価格: | - |
| 最低注文量: | - |
| パッケージの詳細: | - |
| 納期: | - |
| 供給能力: | - |
| 支払いタイプ: | - |
| 製品グループ : | - |
