タイトルまたは説明

FR4 double-sided PCB with immersion gold  

Product Description

We are a professional factory with *6 years experience in manufacturing printed circuit boards, which can be made by a various of materials such as Aluminum/FR4/Cermic/Rogers/High Frenquency/FR1/FR2/FR4/CEM1/CEM3.

Your are welcome to check this FR4 PCB board with good quality and cheap prices.

Note: FR*4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one, or both sides of an FR*4 glass epoxy panel. These are commonly referred to as copperclad laminates.

FR*4 copper-clad sheets are fabricated with circuitry etched into copper layers to produce printed circuit boards. More sophisticated and complex FR*4 printed circuit boards are produced in multiple layers, also known as multilayer circuitry.

• Base Material: FR4
• Number of Layers: 2L
• Board Thickness: 0.8mm
• Copper Thickness: 1OZ
• Min. Hole Size: 3mil (0.**5mm)
• Min. Line Spacing: 3mil (0.**5mm)
• Min. Line Width: 3mil (0.**5mm)
• Surface Finishing: Immersion Gold
• Solder Mask Color: Green
• Certificate: UL, ISO ***1, ISO ****1

FR4 is the most commonly used PCB material now, so its widely used for motorcycle and mobile phone, power LED and acoustics shielding system etc.

• Layer: 1 to *8 layers
• Material type: FR*4, CEM*1, CEM*3, High TG, FR4 Halogen Free, Rogers
• Board thickness: 0.*1mm to 7.0mm
• Copper thickness: 0.5 OZ to 7.0 OZ
• Copper thickness in hole: >*5.0 um (>1mil)
• Size:
  Max. Board Size: *3 × *5 (**0mm×**0mm)
  Min. Drilled Hole Size: 3mil (0.**5mm)
  Min. Line Width: 3mil (0.**5mm)
  Min. Line Spacing: 3mil (0.**5mm)
• Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
• Solder Mask Color: Green/Yellow/Black/White/Red/Blue
• Tolerance
  Shape tolerance: ±0.*3
  Hole tolerance: PTH: ±0.**6 NPTH: ±0.*5
• PCB Packing
  Inner packing: Vacuum packing / Plastic bag
  Outer packing: Standard carton packing
• Certificate: UL, ISO ***1, ISO ****1
• Special requirements: Buried and blind vias+controlled impedance +BGA
• Profiling: Punching, Routing, V-CUT, Beveling
• Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.