GL-06B High power outdoor maintenance-free 100w led flood light

タイトルまたは説明

Product features:

1.High efficiency and low energy consumption: imported LED chip for light source, light efficiency reaching to ******0lm/v, saving more than *0% energy in comparison to halogen lamp.

2.One single casting aluminum case, hi-po electrostatic powder plastic spraying surface, corrosion and rust resistant.

3.4mm special anti-dazzle steel glass, heat & impact resistant.

4.Radiator consists of *2 pieces of ***0 aluminum radiating sheet, the heat transmitting index of ***0 aluminum is **6W/mk.

5.Environment friendly, no lead and mercury, no infrared andultraviolet ray radiation

6.Even and comfortable light, no overlapping shadow; Good color rendering, color temperature close to the sunlight.

7.Power with constant current and constant voltage control; can endure the undulation from the grid, no noise and no stroboflash.

8.Exterior fastener uses stainless steel, dainty and endurable.

9.Built-inor built-outpower supply.





Specifications:

Rated Voltage: AC **0V

Rated Power: LED *00W(**0W custom made)

Luminous flux: *00W  *0**0lm

Casing material: High strength aluminum alloy

Transparent part material: Special steel glass

Waterproof:IP65

Corrosion-proof:WF2

Weight: 5.2Kg

Dimension: **0***0.5***0mm

Mounting method: wall mounted, ceiling mounted and seat mounted 



Product heat dissipation advantage：
 

• High thermal conductivity***3 aluminum radiating sheet:**1W/mK，it is 2.3 times higher than traditional ADC*2die-casting aluminium: *6W/mK.
• Chip substrate usingredcopper，thermal conductivity:**1W/mk,capacity of heat transmission increased double times compared with aluminum.
• Thermally Conductive Silicone use DOW CORNING，thermal conductivity:3.3，gray color，it makes the chip heat passed through thermal conductive silicone rapidly to the radiator fins. General lamps and lanterns manufacturers choose white thermal conductive silicone, heat conduction coefficient is 0.8~1.2.
• Lighting up half an hour，negative spot weld temperature less than *5℃；fins in back temperature different in5℃；chip temperature different with chip back also in5℃.
• The heat sink thickening processing, greatly increases the heat dissipation area, heat faster and more efficient.
• Uniform light color.