タイトルまたは説明

GT-FC****1.1

Flip Chip for High Bay

High Bay Lights LEDs Flip Chip

GT-FC**0(SP***0)

Power:FC*****0W

Luminous area:*3.*8**3.*8mm

RoHS compliant

5 Years Warranty

High CRI COB LED Chip Description

High Reliability and Stability

Ceramic base with flip chip mounted, no gold wire bonding

High heat conductivity red copper substrate

High temperature eutectic welding technique

Reliable raw materials applied with super fast heat transfer

Patented phosphor coating techonology

Outstanding Projecting Performance

High power & lux density with super even light distribution

Minimum distance in-between China Flip Chip for High Bay to achieve surface emitting effect

Extremely small LES optimized for focused lighting purpose

Flexible Application Features of High Stability Flip Chip

Equipped with temperature sensor and quick connector

A wide power range from *0W to **0W optional

High Bay Light Flip Chip Application: stage light, projector, searchlight and long-distance lighting applications,etc

Product Specification