heat exchange, cooling for CPU, copper foam, opencell copper, cu foam

タイトルまたは説明

The technology of producing copper foam by Shanghai Winfay New Material Co., Ltd is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics ***** Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers. Below is the conventional evaluation of copper foam made by Shanghai Winfay. Porosity: 5—**0 PPI (pores per inch) Density: 0.*5~0.*5g/cm3 Cavity: *0%—*8% Element: Cu+Ni, Cu+Al, Cu+Zn Volume: **0×**0×1—**0mm Feature: 1. Excellent mechanical property and processability; 2. Extraordinary electricity and heat conductivity; 3. Massive intricate, lattice-like inner structure 4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility; 5. Magnificent electromagnetic shielding ability. Special specification are available upon request.