タイトルまたは説明

Linden's molded LCP functionally-hermetic packages for use with optoelectronic components are a replacement for more costly and traditional ceramic and metal packages. Linden's proprietary LCP buffered fiber is used as pigtails and, where it exits the package, seals seamlessly to the molded LCP housing and lid. Packaging is often *0% of the cost of an optoelectronic component. Molded LCP packages eliminate the need for expensive machined or cast metal and ceramic packages. LCP buffered fiber, because of lower moisture transmission, replaces more expensive metalized fiber pigtails. Packaging cost can be reduced by an order of magnitude.