Hi-Tg Blind and Buried Holes

タイトルまたは説明

• Layers: 1 to *0
• Materials: FR*4, CEM*1, aluminum, Rogers, Taconic, Getek, and Arlon
• Finish board thickness: 0.2 to 3.2mm
• External copper thickness: *5 to **0um
• Internal copper thickness: *7 to **0um
• Copper plating hole: *8 to *0um
• Trace width and line spacing: 0.**5/0.1mm (3/4 mils)
• Minimum CNC hole diameter: 0.*0mm
• Minimum punching hole diameter: 0.9mm (*5 mils)
• Maximum panel dimensions: **0 x **8mm
• Hole position tolerance: 0.**5mm
• Hole dimension tolerance:
  • PTH: 0.**5mm
  • NPTH: 0.*5mm
• Outline tolerance:
  • CNC: 0.**5mm
  • Punching: 0.*5mm
• Warp and twist: 0.*0%
• Minimum solder mask bridge: 0.***5mm
• Minimum distance between line to board bridge:
  • Outline: 0.*5mm
  • V-cut: 0.*0mm
• Impedance control tolerance: ±*0%
• Test voltage: *0 to **0V
• Solder mask types: green, yellow, red, white, blue, matte green, matte black, and more
• Surface finishes: HASL, immersion gold, immersion silver, plated gold, gold finger, and OSP