离岸价格
Get Latest Price9 ~ 99 USD / Unit ( Negotiable )
|1 Piece Minimum Order
国:
China
モデル番号:
BIC-001-V1.0
离岸价格:
9 ~ 99 USD / Unit ( Negotiable ) Get Latest Price
ロケーション:
China
最低注文量の価格:
9 per Unit
最低注文量:
1 Piece
パッケージの詳細:
vaccume
納期:
10 working days
供給能力:
50000 Piece per Month
支払いタイプ:
T/T
製品グループ :
-
連絡先担当者 Mr. Kevin
3-203, Shidai Jingyuan, fuyong, baoan, shenzhen, Guangdong
High Frequency PCB Rogers *0mil 1.**4mm
RO***0B Double Sided RF Circuit Board Patch Antenna
PCB
RO***0B hydrocarbon ceramic laminates are
designed to offer superior high frequency performance and low cost
circuit fabrication. The selection of laminates typically available
to designers is significantly reduced once operational frequencies
increase to **0 MHz and above.
RO***0B material possesses the properties
needed by designers of RF microwave circuits and matching networks
and controlled impedance transmission lines. Low dielectric loss
allows RO***0B material to be used in many applications where
higher operating frequencies limit the use of conventional circuit
board materials.
The temperature coefficient of dielectric
constant is among the lowest of any circuit board material, and the
dielectric constant is stable over a broad frequency
range.
RO***0B material's thermal coefficient of
expansion(CTE) provides several key benefits to the PCB designers.
The expansion coefficient of RO***0B is similar to that of copper
which allows the material to exhibit excellent dimensional
stability, a property needed for mixed dielectric multi-layer
boards constructions.
The low Z-axis CTE of RO***0B provides
reliable plated through-hole quality, even in severe thermal shock
applications. RO***0B material has a Tg of >**0C so its
expansion characteristics remain stable over the entire range of
PCB processing temperatures.
Parameters of a type of 1.6mm RO***0B
PCB
| PCB SIZE | **5 x **5mm=1PCS |
| BOARD TYPE | High frequency PCB, RF PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ******- *5um(1oz)+PLATE |
| RO***0B *0mil | |
| copper ******- *5um(1oz)+PLATE | |
| TECHNOLOGY | |
| Minimum Trace and Space: | *1mil/*2mil |
| Minimum / Maximum Holes: | 0.3/2.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | **4 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO***0B *0mil, Tg **8℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.*6 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over **0 microinch nickel) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL **-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.***9" (0.*5mm) |
| Board plating: | 0.***0" (0.**6mm) |
| Drill tolerance: | 0.**2" (0.*5mm) |
| TEST | **0% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS****-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
| RO***0B Typical Value | |||||
| Property | RO***0B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.*8±0.*5 | Z | *0 GHz/*3℃ | IPC-TM***0 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.*6 | Z | 8 to *0 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ |
0.***7 0.***1 |
Z |
*0 GHz/*3℃ 2.5 GHz/*3℃ |
IPC-TM***0 2.5.5.5 | |
| Thermal Coefficient of ε | **0 | Z | ppm/℃ | **0℃to **0℃ | IPC-TM***0 2.5.5.5 |
| Volume Resistivity | 1.2 x ***0 | MΩ.cm | COND A | IPC-TM***0 2.5.*7.1 | |
| Surface Resistivity | 5.7 x**9 | MΩ | COND A | IPC-TM***0 2.5.*7.1 | |
| Electrical Strength | *1.2(**0) | Z | Kv/mm(v/mil) | 0.*1mm(0.**0") | IPC-TM***0 2.5.6.2 |
| Tensile Modulus |
*6,**7(2,**2) *4,**3(2,**3) |
X Y |
MPa(ksi) | RT | ASTM D **8 |
| Tensile Strength |
**3(*9.5) **0(*8.9) |
X Y |
MPa(ksi) | RT | ASTM D **8 |
| Flexural Strength |
**5 (*7) |
MPa (kpsi) |
IPC-TM***0 2.4.4 | ||
| Dimensional Stability | <0.5 | X,Y |
mm/m (mil/inch) |
after etch+E2/**0℃ | IPC-TM***0 2.4.*9A |
| Coefficient of Thermal Expansion |
*0 *2 *2 |
X Y Z |
ppm/℃ | **5℃to**8℃ | IPC-TM***0 2.4.*1 |
| Tg | >**0 | ℃ TMA | A | IPC-TM***0 2.4.*4.3 | |
| Td | **0 | ℃ TGA | ASTM D ***0 | ||
| Thermal Conductivity | 0.*9 | W/M/oK | *0℃ | ASTM C**8 | |
| Moisture Absorption | 0.*6 | % |
*8hrs immersion 0.**0" sample Temperature *0℃ |
ASTM D **0 | |
| Density | 1.*6 | gm/cm3 | *3℃ | ASTM D **2 | |
| Copper Peel Stength |
0.*8 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM***0 2.4.8 | |
| Flammability | (3)V*0 | UL *4 | |||
| Lead-free Process Compatible | Yes | ||||
| 国: | China |
| モデル番号: | BIC-001-V1.0 |
| 离岸价格: | 9 ~ 99 / Unit ( Negotiable ) Get Latest Price |
| ロケーション: | China |
| 最低注文量の価格: | 9 per Unit |
| 最低注文量: | 1 Piece |
| パッケージの詳細: | vaccume |
| 納期: | 10 working days |
| 供給能力: | 50000 Piece per Month |
| 支払いタイプ: | T/T |
| 製品グループ : | - |
