High quality! Resin Bond grinding disk for ceramic

离岸价格

Get Latest Price

80 ~ 200 / Piece

1 Piece Minimum Order

国:

China

モデル番号:

1A1, 6A2, 12A1, 12A2, 14A1, etc.

离岸价格:

80 ~ 200 / Piece （交渉可能） Get Latest Price

ロケーション:

最低注文量の価格:

80 per Piece

最低注文量:

1 Piece

パッケージの詳細:

Carton box with foam box. (Gift package is available)

納期:

7-15 days

供給能力:

20000 Piece per Month

支払いタイプ:

T/T, L/C, D/P, Western Union, Money Gram, PayPal

製品グループ :

今すぐお問い合わせください

ENOVO Diamond Tools Co., Ltd

China

無料会員

連絡先担当者 enovo

South Tongbai Rd, Zhengzhou, Henan

今すぐお問い合わせください

製品仕様

Advantage:High efficient and long life
Concentration:100%/150%
Shape:Bowl-shaped/cup-shaped

タイトルまたは説明

Resin Bond grinding disk
Main Features:
1.Excelllent cutting capacity
2.Quality cutting of hard and fragile materials
3.Varieties of bonds, suitable for cutting all kinds of materials

Application:
Resin bond dicing blade is mainly used to cut and make groove in metal and nonmetal materials which are hard to cut and groove, such as:
1 .Semiconductor materials:Si, Ge, GaP, GaAs, GaAsP, BiSb, BGA, QFN,SiC,FQFN, solar battery and so on.

2.Ceramic materials:Al2O3,ZrO2, Si3N4,BaTiO3,CaTiO3 and so on.

3.Magnetic materials: magnetic core, magnetic sheet and so on.

4.Metal materials:high speed steel, tool steel, die steel, bearing steel and so on.

5.Other materials: glass, crystal, electronic components and so on.
Tolerance

OD (mm)		Thickness (mm)		ID(mm)
Size	Tolerance	Size	Tolerance	Size	Tolerance
49~125	±0.02	(OD 50~90)		25.4 / 40 / 88.9	H7
		0.05~0.1	+0.01~0.005
		0.11~0.5	±0.01
		(OD 91~125)
		0.1~0.5	±0.015

Grit Size / Standard Specification

   Size designation:  D x TE x H, where: D-Outside Blade Diameter, TE Blade Thickness, H- Blade Inside Diameter.
Note: Our standard Tolerance on Outside Diameter for all blades is  +/-.002, tolerance. Higher tolerances are available upon request
More Detailed Info.

1. Resin bond blades with the characteristic of vertical consumption can efficiently reduce the occurrence of grain deformation and improve the cutting quality and efficiency on hard and brittle materials.

      Features of resin bond dicing blades
Improve the cutting quality and efficiency on hard and brittle materials.
A wide selection of bonds available for high-grade processing on hard and brittle materials.
Ultra thin blade ( over 50um)

       Applications of resin bond dicing blades
Hard and Brittle Materials, Ceramics, Optical Glass, Glass for Optical Fiber Communication, Splitter,IR Filter, QFN
Specification of resin bond dicing blades
       OD: 50-125mm
       ID: 25.4/40/88.9
       Thickness: 0.10-2.00mm (Based on diamond grit size)
       Grit: 200#-5000# (D107-D1)

2. Metal bond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain.
With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.

Features of Metal bond dicing blades
Ultra thin blade ( over 45um)
A wide selection of bonds available for various semiconductor packages.

Applications of Metal bond dicing blades
Sapphire,BGA,Optical Glass,CSP
Specification of Metal bond dicing blades
       OD: 50-125mm
       ID: 25.4/40/88.9
       Thickness: 0.10-2.00mm (Based on diamond grit size)
     Grit: 200#-5000# (D107-D1)
3. Vitrified bond blade with high rigidity and cutting capability are able to keep
the straightness on the entry point and precision of work dimension during
high-loading process. Consequently, this kind of blade realizes advanced
machining on hard materials like crystals and sapphires.

Features of vitrified bond dicing blades
Initiative conductive vitrified bond
Porosity material
Realizes high quality process on high hardness
materials like crystals and sapphires
Applications of vitrified bond dicing blades
Hard and Brittle Materials (Crystal, Sapphire, Ceramic)
4. Electroformed bond blades are featured by ultra thin, high strength and
stiffness. They can also suppress the deformation of blade shape and
give high endurance and robust properties during cutting process.
Features of Electroformed bond dicing blades
Sophisticated electroformed.
A wide selection of bonds available for various kinds of workpieces.
Exclusive development and customization technology.
Applications of Electroformed bond dicing blades
Compound, Silicon, Magnetic Materials, Ceramic Raw Material
Ceramic, Glass Epoxy Boards, etc.
Specifications of Electroformed bond dicing blades
       OD: 50-125mm
       ID: 25.4/40/88.9
       Thickness: 0.10-2.00mm (Based on diamond grit size)
       Grit: 200#-5000# (D107-D1)
5.Hub blade is deployed on silicon wafer and compound semiconductor wafer
cutting. Micrometer electroformed technology provides higher process quality.

Features
Precise control of diamond distribution.
Ultra high-speed separation filters diamond grain in high precision.
Well-proportioned diamond distribution on surface reduces back side chipping.
Applications
Silicon Wafers, IC/LED Packages, CSP/BGA, Compound Semiconductor, Optical Glass

Product Variety	Size(mm)
	Diameter	Inner hole	Thickness
Metal/Resin bond One-piece	30-50	20-40	0.1-0.3
		9-40	0.4-2.0
	55-60	20-40	0.1-0.15
		9-40	0.15-0.3
			0.4-2.0
	62-70	9-40	0.15-0.3
			0.4-20
	75-100	20-70	0.15-0.3
		10-70	0.4-2.0
	101-125	20-90	0.25-0.5
			0.6-2.0
	127-155	30-115	0.3-0.5
			0.6-2.0

国:	China
モデル番号:	1A1, 6A2, 12A1, 12A2, 14A1, etc.
离岸价格:	80 ~ 200 / Piece （交渉可能） Get Latest Price
ロケーション:	-
最低注文量の価格:	80 per Piece
最低注文量:	1 Piece
パッケージの詳細:	Carton box with foam box. (Gift package is available)
納期:	7-15 days
供給能力:	20000 Piece per Month
支払いタイプ:	T/T, L/C, D/P, Western Union, Money Gram, PayPal
製品グループ :	-