タイトルまたは説明

desoldering&soldering optical lens observing micrometer positioning flexible&removable operation top hotairflow adjust Detailed Description Smart desoldering&soldering ZM-R****0 BGA chip repair machine Features: 1: beautiful outlook, room space save. 2: 2hot air heaters, IR preheater with germany heating plates(output adjustable, so the total power consumption adjustable too), IR preheater with metal cover to protect motherboard 3: HD CCD color imaging system*8.0'' LCD monitor+Micrometer measureemnt complete the bga chip positioning process. 4: Flexible and removable PCB supporting holder fasten motherbord and ensure the welding effect. 5: Top hot air flow on the surface of machine in black, ps:please screw to max*0. 6: Touch screen to set temperature parameter. seven temperature curves in different colors. red one is for instant analysis which you can move freely on touch screen. 7: mounting, desoldering and soldering work automatically. almost **0% sucess reach. 8: store and memory profiles you set, when the store space full, you can set again to cover the ***** 9: BGA and PCB imaging brightness can be adjust on the surface of machine. imaging zoom in or out as well on the surface. *0: Equipped with pressureand optical sensors. control the pressure in***0 grams and optical switches, so that it can automatically recognize the suction chip& mounting height, ensure not crush BGA chip. *1: Socket**5, double BGA/CGA/VGA/IC and varous shielding devices avaliable *2: Meet lead free requirements. *3: NW:**0KG Dimensions: *9**9***0CM