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USA
連絡先担当者 Nisreen
Aliso Viejo, California
Details: SR3AR/***4/CD************2 General informationTypeCPU / MicroprocessorMarket segmentServerFamilyIntel Xeon GoldModel number ***4CPU part numbersCD************2 is an OEM/tray microprocessorBX********4 is a boxed microprocessorFrequency ***0 MHzMaximum turbo frequency***0 MHzBus speed *0.4 GT/s UPIClock multiplier *2Package****-land Flip-Chip Land Grid Array (FC-LGA)SocketSocket ***7 / P0 / LGA*****0Size2.*9" x 2.*2" / 7.6cm x 5.*5cmFan/heatsink1U form factorIntroduction date****7Price at introduction S-spec numbersPart numberProduction processors SR3ARBX********4+CD************2+Architecture / MicroarchitectureMicroarchitectureSkylakePlatformPurleyProcessor core Skylake-SPCore stepping H0 (SR3AR)Manufacturing process0.**4 micronDieXCC typeData width*4 bitThe number of CPU cores8The number of threads*6Floating Point UnitIntegratedLevel 1 cache size 8 x *2 KB instruction caches8 x *2 KB data cachesLevel 2 cache size 8 x 1 MB cachesLevel 3 cache size*4.*5 MB non-inclusive shared cachePhysical memory**8 GBMultiprocessingUp to 4 processorsFeaturesMMX instructionsSSE / Streaming SIMD ExtensionsSSE2 / Streaming SIMD Extensions 2SSE3 / Streaming SIMD Extensions 3SSSE3 / Supplemental Streaming SIMD Extensions 3SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructionsAVX / Advanced Vector ExtensionsAVX2 / Advanced Vector Extensions 2.0AVX***2 / Advanced Vector Extensions **2BMI / BMI1 + BMI2 / Bit Manipulation instructionsF*6C / **-bit Floating-Point conversion instructionsFMA3 / *-operand Fused Multiply-Add instructionsEM*4T / Extended Memory *4 technology / Intel *4 NX / XD / Execute disable bit HT / Hyper-Threading technology VT-x / Virtualization technology TBT 2.0 / Turbo Boost technology 2.0 TXT / Trusted Execution technologyTSX / Transactional Synchronization ExtensionsIntegrated peripherals / componentsIntegrated graphicsNoneMemory controllerThe number of controllers: 2Memory channels per controller: 3Supported memory: DDR*****6DIMMs per channel: 2ECC supported: YesOther peripheralsUltra Path Interconnect (3 links)PCI Express 3.0 interface (*8 lanes)Direct Media Interface 3.0 (4 lanes)Electrical / Thermal parametersMaximum operating temperature *9°C (case temperature)**0°C (Digital Thermal Sensor)Thermal Design Power **0 Watt
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