タイトルまたは説明

CNC machine, laser diode, marking laser, Laser Machine, YAG laser, Laser Marking, Laser Etching, Engraving Machine, Marking Machine, Laser Engraving Machine, Laser Marker, Laser Marking Machine, metal laser marking, laser marking system, laser diode pump, diode pump laser,
Laser diode pump, YAG laser marking, diode side pump laser marking machine, laser marking and engraving, laser etching machine, laser marking equipment, marking equipment, YAG laser marking
Laser marking equipment is:
1. High efficiency (up to *0 %), less consumption.
2. Long life: Some light power measurement in the measurement equipment manufacturer of the laser light source change the initial He - laser into diode laser, in order to get the best machinery life (He - en general for *0 ^ laser life, while diode laser four HR for *0 ^ 5HR life, a difference of ten times), especially suitable for on-site long operation.

3. It can achieve a switch function instantly, so it is appropriate communication purposes. Semiconductor laser marking machine will be settled soon when starting, and with circuit modulation is very appropriate, such as the output pulse wave modulation method can be used measured distance (and He - en *0 minutes of laser must boot only stable, this is absolutely not the semi-conductor laser).

4. Available in different wavelength: Using periodic table, for example III/V family gaas chemical compounds can be made of laser diode, when the current is conveyed pn interface, because of through different compounds to send out all visible laser and not visible laser. Semiconductor laser just change the proportion of combined elements so as to change the different energy interval, and different energy interval, provide a different output wavelength. Because of the infrared and red wavelengths in communication and measurement, it is easily with the various sensors on with and get very wide range of purposes.

5. Mechanical properties aspects: Have strong, weight light advantages.

Type: XN-DP*0
Biggest laser power: *0W
Laser wavelength: ***4nm
Beam quality: M2 < 3.5
Laser repeat frequency: ≤ *0kHz
Marking scope: **0 x **0mm (optional)
Marking depth: ≤ 0.3mm
Marking line speed: Acuities ***0mm/s
Minimum line width 0.**5 mm
Minimum character size: 0.3 mm
Repeat precision: ± 0.*1 mm
Input power: 1.3KW
Electrical source: **0V/single-phase / *0Hz / *5A

Areas of application:
1. Metallic materials: Stainless steel, copper, iron, aluminum and other metal and alloy, are often used for watchcase, MP3, mobile phone hull etc. Laser marking.
2. Metal oxidation, phosphating, plating surface marking: Hardware products, U plate shell, etc.
3. EP and PC materials laser marking: Electronic component packaging, IC, etc.
4. ABS plastic: Electrical housing, electronic products and other product serial number, LOGO, etc.
5. Ink and paint: Mobile phone key-press, panel, daily necessities, printing products.