low melting point thermal interface material

The TIC™**0A Series is low melting point thermal interface material. At *0℃, The TIC™**0A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™**0A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 
      The TIC™**0A Series shows no thermal performance degradation after 1,**0  after **0 cycles, from **5℃ to **5℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 
Features
》0.**0℃-in² /W thermal resistance
》Naturally tacky at room temperature, no adhesive required             
》No heat sink preheating required 
Applications
》High Frequency Microprocessors
》Notebook and Desktop PCs
》Computer Serves
》Memory Modules
》Cache Chips
》IGBTs

 

Typical Properties of TIC™**0A Series
Product Name	TICTM**3A	TICTM**5A	TICTM**8A	TICTM**0A	Testing standards
Color	Ashy	Ashy	Ashy	Ashy	Visual
Composite Thickness	0.**3" (0.**6mm)	0.**5" (0.**6mm)	0.**8" (0.**3mm)	0.**0" (0.**4mm)	　
Thickness Tolerance	±0.***6" (±0.**6mm)	±0.***8" (±0.**9mm)	±0.***8" (±0.**9mm)	±0.***2" (±0.**0mm)	　
Density	2.5g/cc				  Helium   Pycnometer
Work Temperature	**5℃～**5℃				　
phase transition  temperature	*0℃~*0℃				　
Setting temperature	*0℃ for 5 minutes				　
Thermal conductivity	2.5 W/mK				ASTM D***0 (modified)
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