タイトルまたは説明

Capability of MPCB
Material
 Aluminum Base Copper Clad Laminate
 Remark&Test
Layer count
 **2layer
  
Min track& width
 0.1 mm (4mil)
  
Min Hole Size Drilled hole
 φ 0.*0 mm
  
Punched hole φ 2.0 mm   
Max drill collar/ring φ 8.*0 mm MIL-P*****7 
Dimensional tolerance Track Width
 ± *0%
 IPC-TM***0 2,4,9
Hole Size ± 0.*5 mm  
Accumulated Space ± 0.*0 mm  
Board outline tolerance ± 0.1 mm L ≤*0 mm
Distance between board edges ± 0.*5 mm
 C ≤5.0 mm 
Surface Finish ENIG Au(0.***0.*0 um);Ni(**6 um)  X-RAY
HASL(lead free) Sn(***8 um) 
OSP 0.**0.8um 
Welding temperauture Meet the lead -free soldering