• SMT & Through-hole
• High Speed Placement
• BGA and Micro-BGA Capabilities
• ****5 Placement
• Optimized Reflow Profiling
• Turnkey or Consigned Kits
• Press Fit Connectors
• Quick-Turn Assemblies (Same Day & Next Day)
• Prototype Quantities
• Production Quantitiesw/Scheduled Deliveries
• High Volume Production
• Double-Sided SMT
• De-ionized Wash
• Rework Capabilities
• IPC-A***0 Class III Certified
• Strict ESD Control
• Mechanical Assembly and Box Builds
• Cable & Harness Assembly
•  

• Functional Testing

SMT major equipments

Line 1: HS*0+HS*3+F5+Refflo+AOI

Line 2:HS*0+HF3+Refflo+AOI

Line 3: HS*0+HS*3+F3+Refflo+AOI

Line 4: HS*0+F3+Refflo+AOI

Line 5: HS*0+F3+Refflo+AOI

The capablity of assembling has been reached 6 million points per day, the capablity of DIP is *8 thousands per day.

DIP product line

Line 1. hand weling+wave soldering

Line 2. hand weling+wave soldering