タイトルまたは説明

Mobile Phone FPC

1. Camera module (BGA) uses cover layer production process to replace solder mask ink production process, improving work efficiency, shortening production process flow, and increasing volume production yield to more than *5%.

2. By equipment replacement and technical breakthrough, it can produce fine line with 0.*5mm width/distance in batches. 

3. Product diversification: Batch production of single sided and double sided plates, impedance plates, BGA, LCD, backlights, hollow plates, multi-layer boards, rigid-flexible PCB, gold-plating/ aluminum-plating products.

The company owns FPC full-process production equipment, and can produce chemical nickel/ gold plating, nickel/ gold electroplating, pure tin electroplating and immersion tin by surface treatment.