タイトルまたは説明

Number of layer: ***0L
Base material: CEM*3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc.
Copper weight: 0.5OZ*6OZ(*8mil***0mil)
Board thickness: 0.**7.2mm(8mil***2mil)
Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc.
Silk screen: White, blue, black, etc.
Solder mask: Green, black, red, blue, yellow, white, etc.
Surface finished: OSP, HASL, ENIG, ENEPIG, Silver, Gold plating, Hard gold, Immersion Tin, Immersion Gold, Carbon ink, etc.
Test: Fly Probe test, fixture test
Performance test: **0% electricity performance test
Min hole size: 0.2mm, Laser 0.1mm
Min line width/Space: 3mil/2mil
Outline profile: Rout, V-cut, Bridge, Stamp hole
Max panel size: ***0***0mm for Single and double side, **0***0mm for multi-layer
Min panel size: *0**0mm
Hole center position tolerance: ±0.*5mm