PCB Assembly

タイトルまたは説明

Specifications: Number of layers: single, double and 3 to *0 Copper thickness: 0.5 to 4oz Laminate material: FR*4, FR*4 High TG, F4B, FR*4 Halogen Free, CEM*3 and CME*1 Base board thickness: 0.3 to 4.0mm Surface finishing: OSP, Lead-free HASL, Immersion Gold, silver, soft Au, nickel plating and gold finger，Immersion Tin, Peelable Mask Twist: 0.5% Insulation resistance: *0 (*1) Test voltage: **0 to **0V Thermal cycling ability: **8C/five seconds（FR4） Finished board area: **0 x **0mm Minimum line width and spacing: 0.**5/0.**5mm Copper thickness in hole: *5.0μm Minimum pad diameter inner layer: 0.5mm Minimum hole diameter: 0.2mm Hole tolerances: PTH: *0.**5mm NPTH: + 0.*5mm Hole location tolerance: *0.**5mm Profile tolerance CNC routing: +/*0.*3mm Profile tolerance CNC punching: +/*0.*1mm Solder mask bridge ability: 0.1mm Solder mask rigidity: six hours Solderable test: **5C/five seconds Incombustibility: *4V0 Inner packing: vacuum or plastic Outer packing: standard carton