タイトルまたは説明

ZP***1 Surface Mount Backflow Soldering Machine
I. PCB Production Line Equipment Function
Surface mount backflow soldering machine
II. PCB Processing Educational System Technical parameter
1. In welding process, PCB is in static state/ The surface components should be in correct position, and avoid not be soldering.
2. Soldering zone use far infrared ray heat, and high temperature motor force to be heated.
3. Equip with nitrogen protection connector, and use nitrogen to make protection.
4. Soldering zone use fuzzy control technology, you can only set 3 units of technical parameter, then you can control the whole temperature curve, and you can follow temperature change, blue backlight LCD display.
5. Scientific Laboratory Equipment use **0×**0mm dot matrix high resolution LCD display, the dimension of LCD is **3mm Dot matrix high resolution LCD*0mm.
6. The solding machine can be connected to PC, and use backflow curve to record save software.
7. The welding machine has 4 ways temperature sensor interface, sensor head is PT**0, it can correct welding temperature curve through backflow analysis
8. Chemical Laboratory Equipment Dimension: **0×**0×**0mm
9. Peak power: 3.5KW