タイトルまたは説明

Polyimide (PI) resin of BMI type. It is a kind of coploymerisation PI prepolymer. It is widely used in Diamond grinding wheels and moulding process powder with short fibre. It also be used for adhesive of laminating composite etc. Its mould pressing products or laminating products can be applied at **0�C in long term and be able to endure a high temperature of **0�C at short term. It is a based resin with excellent comprehensive performance for high temperature-resisting polymeric composites.