タイトルまたは説明

Glass fiber board fr*4 production quipment item and parameters: 1.surface treatment :OSP, Shen tin, Shen silver, Lead-free, spray tin, nickel gold plating. 2.layer:***6 3.width of smallest wire:0.**6mm ***** spacing wire:0.**6mm ***** line to disk.disk to disk space:0.**6mm ***** diameter of drill knife:0.2mm ***** diameter of the hole pad:0.*5mm ***** prpportion of driling thickness:1:6.4 ***** measurement:**0x**0 mm *0.processing thickness:0.**3.2mm ***** width of hte green oil bridge:0.*8mm ***** unilateral window(of green oil clearance):0.*5mm ***** thickness of the green oil:0.*5mm *4.solder mask:photographic solder mask.hot-solder mask.UVsolder mask. 1***** characters linewidth:0.1mil 1***** height characters:0.7mm *7.silk screen chiaracters&solder mask color:white, yellow, black, green, aureate. *8.data file format:******9se.PADS **8performance test:impedance. a short-circuit test. a test for governance *0.Various types of sheet metal for the PCB substrate processing:******3.*2F.height G ***** testing requiements:***** ***** test *2.Special production process: jet-godfinger(blind orifice), v-shaped orifice ***** foil thickness:H/H OZ.1/1 OZ.2/2 OZ.3/3 OZ. 4/4 ***** *4.double-four sided layer:***0days six-eight sides layer:****0days eightlayers more than ****0days