タイトルまたは説明

1.Surface Treatment ****- Electrolyses lead , Immersion Gold/Nickle, OSP 2. Number of Layer:****- Single Sided , Two-sided and multilayer , Special layer 3. Max. PCB Size******0mm***0mm 4. PCB Thickness*****0.**0.3mm 5. Copper Foil Thickness*****-H 1 2 3 4 5 6 *0(oz) 6. Insulating Layer Thickness***********0 *5 **0 **5 **0(um) 7. Metal Base Type:*****- Al(***0, ***2, ***1), Cu, Fe, Stainless Steel etc. 8 Metal Substrate ******0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2(mm) 9. Shaping ******- Die PunchingStampingRouteV-Cut *0.Solder Mask Colour ****-GreenWhiteBlackRedYellow *1.Silk Screen Colour*****-GreenWhiteBlackRedYellow *2 The Minimum Letter Height*****0.8mm *3 The Minimum Letter Line Width ***- 0.*5mm xxxxx Minimum Line Width ****- 0.*5mm *5 The Minimum Line Spacing*****0.*5mm *6 The Minimum Hole Diameter******0.5mm *7 Special hole*****-Spot facing, , cup hole