ROHS PCB

タイトルまたは説明

PCB Specification：

Size                 **0 x**0mm
Material           FR4
No of Layers   6
Thickness      1.6 MM
Finish               ENIG
Copper Weight  1.0oz       
Solder mask    Green,LPI
Legend              White
Panel Form       2*5
Profilling             CNC
Packing              Vacuum plastic and cartons
Application         Communication

The design does not contain Blind Vias 
The design does not contain Buried Vias  
The design does not contain holes smaller than 0.*5mm (0.**0inches)

The design conforms to the following design rules
(For multilayer boards)
Minimum track thickness 5 mil (0.*3mm)
Minimum track clearance 5 mil (0.*3mm)
(For single and double sided boards)
Minimum track thickness 6 mil (0.*5mm)
Minimum track clearance 6 mil (0.*5mm)

Layer Description
(Note: Inner layers are counted from the top downwards)

Top Silk Screen Overlay       Designname.GTO
Top Solder Mask                   Designname.GTS
Top Copper                            Designname.GTL
Inner Copper 1                      Designname.G1
Inner Copper 2                      Designname.G2
Bottom Copper                      Designname.GBL
Bottom Solder Mask             Designname.GBS
Bottom Silk Screen               Designname.GBO
NC Drill File                            Designname.GDD
Outline                                     Designname.GM1