Semiconductor laser marking machine

タイトルまたは説明

Semiconductor laser marking machine ●This machine adopts semiconductor pump solid laser. It pumps Nd: YAG medium with the semiconductor laser of **8 nm wavelength, makes the medium produce a mass of reversal particles, and then output high energy laser pulse with wavelength of ***4 nm under the effect of Q switch. ●This laser has high photoelectric conversion efficiency, ●It's volume is 1/4 of the conventional lamp pump laser. ●The professional laser resonance cavity ensures the quality of output beam , and fine marking line. ●Meanwhile, the precision X, Y, Z 3D worktable can achieve exact positioning ●The outside-placed water cooling system has high temperature control accuracy, which ensures a long working life. â—† Software control system ●The software control system adopts Windows operation system and entire Chinese interface. It can be compatible with AUTOCAD, CORELDRAW, PHOTOSHOP, ●It can mark bar codes, images and characters, etc. It can support various file formats, such as PLT, DXF, and BMP, and directly use SHX and TTF font libraries. ●It can automatically encode, and mark serial number, batch number â—† Shaking lens scanning system ●Adopting imported high-speed scanning shaking lens to achieve high scanning accuracy, high speed, reliable performance â—† Adjusting Q system ●Adopting imported sound-light adjusting Q system to achieve small light wastage, it can ensure the laser system a long-time stable running. The frequency adjusting range of 1~*0KHZ makes the system satisfy with various marking requirements of various materials and various effects. It can Carve metal and nonmetal materials; more suitable for circumstances â—†Applications ☆It can carve metal materials and certain nonmetal materials and is widely used in fields that have high requirement on precision and fine, ☆ Applied to electronic components, integrated circuit (IC), electric apparatus, mobile communication, hardware products, tool fittings, precision instrument, glasses, watch and clock, jewelry, automobile parts, plastic keys, construction materials, PVC pipes, medical instruments, etc. ☆ Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components). â—†Specifications: laser output: *0w Laser wavelength: ***4nm Beam quality M2: < 4 Repeating frequency ≤*0kHz Standard marking scope: **0mm×**0mm Optional marking scope: *0mm×*0mm / **0mm×**0mm / **0mm×**0mm Marking depth: ≤0.3mm Marking linear speed: ≤***0mm/s Minimum line width: 0.**5mm Minimum character: 0.3mm Repeat accuracy: ±0.**3mm Total power consumption: 1.5 KW Power supply: **0V/Single phase/*0Hz/*5A Cooling system: Water cooling 3D worktable : the precision X, Y, Z 3D worktable