タイトルまたは説明
This product is mainly used in
semiconductor wafer **0mm ~ **0mm Auã€Cuã€PbSnã€AgSn wet plating processes of different
materials.
The main technological
characteristics
※Adopting PLC + *0 "LCD touch-screen real-time
monitoring, can be stored various process menu .
※Adopt double pulse electroplating power
supply
※A variety of plating system method, various
plating groove selection structure.
※The machine adopts modular structure, plating
trough the quantity may expand according to user requirement
.
※Continuous plating filtrate circularly, flow
frequency conversion control .
※Bath temperature, level, PH value automatic
monitoring .
※High-pressure
DI water infiltrating defoaming function.
※Deionized water injection, emission, rinse
function
※Solution nitrogen
protection
※Fault diagnosis, display and
alarm function
| 国: |
China |
| モデル番号: |
CSE NO.201
|
| 离岸价格: |
（交渉可能）
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| ロケーション: |
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| 最低注文量: |
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![Metrosol Asyst Spartan" EFEM/Sorter Integrated Wafer 3 Load Ports](https://imgusr.tradekey.com/p-B10555375-20160509094928/metrosol-asyst-spartan-amp-quot-efem-sorter-integrated-wafer-3-load-ports.jpg "Metrosol Asyst Spartan" EFEM/Sorter Integrated Wafer 3 Load Ports")
