Semicondustor Marking Machine

タイトルまたは説明

Principles of Semiconductor Side-Pumping Laser Marking Machine:

     Adopted the semi-conductor laser diode pumping ND: YAG medium enables the medium to generate a great deal of inverted population and under the function of Q, there will be the giant pulse laser output with the wavelength of ***4nm, and the electro-optics conversion efficiency is high.Through the computer controlled galvanometer laser beam path, it will realize the automatic marking of plane.

Features:

    The industrial control computer has strong capacity of resisting disturbance, assuring the stable work during the long period

of industrial environment.

    Photoelectric conversion efficiency is high, with compact size, and superior quality of light beam, fine line, and small spot, it

is of long life span.

The latest external water cooling system enables the low operation noise and high temperature adjustment precision.

The high scanning galvanometer is suitable for large batch of industrial production.

Industry Application:

    It is capable to curve the metal materials and partial non-metal materials, especially suitable for some fields required more precise and higher smoothness, is widely used in the electronics separation components, integrated circuit, electrical engineering circuit, mobile communication, hardware, tools, kitchen wares, tool fittings, precise apparatus, eyeglasses and clock, computer keyboard, jewellery accessories, plastic s, water heating fittings, sanitary ware, PVC pipelines, medical apparatus and packing container, etc. 

Advantages:

The equipment appearance is more elegant and operation is convenient.

The laser module is of long life span and stable beam.

The equipment is also can be used as the production line and automatic production line equipments.

With strong software function, it is of red preview function, of the formats including BMP, PLT, bar code and two-dimension

code, etc. supported.

Technical Parameters:

Output power of laser  *0W/*5W

Laser wavelength  ***4nm

Beam quality M2 <6

Repeated frequency of laser  ≤*0KHz

Power stability  <±1%rms

Marking type  Dynamic mark/static mark

Carving scope  **0mm×**0mm

Carving depth   ≤0.3mm

 Marking linear speed  ≤***0mm/s

 Minimum line width   0.**5mm

Minimum character  0.3mm

epeated precision  ±0.**3mm

System operation environment  WindowsXP/***0/*8

Cooling mode    High-precision and constant temperature/closed loop water cooling

Consumption of whole machine  1.5KW

Power requirement    **0V±*2V/*0Hz/6A