Sputtering target

タイトルまたは説明

Pure metal targets: Tin Sn (4N*8N), Nickel Ni (3N*5N), Si Si (4N*6N), chromium Cr (3N*4N), Ti Ti (3N*5N), Mo Mo (3N*5N), zirconium Zr (3N*4N), copper Cu (3N*5N), aluminium Al (3N*5N), cobalt Co (3N*5N) and so on. Alloy target: Aluminum: Aluminum Copper (AlCu), aluminum neodymium (AlNd), aluminum-silicon (AlSi), aluminum titanium (AlTi), Al-Si copper (AlSiCu), Al-Si lead (AlSiPb), Al-Si Ti (AlSiTi) Copper alloys: copper and aluminum (CuAl), copper and magnesium (CuMg), copper silicon (CuSi), copper indium (CuIn), copper tellurium (CuTe) Cobalt: Cobalt, Nickel (CoNi), cobalt chromium (CoCr), cobalt iron (CoFe), cobalt platinum (CoPt), cobalt nickel chromium (CoNiCr), cobalt chromium tantalum (CoCrTa), cobalt chromium platinum (CoCrPt) Nickel: nickel iron (NiFe), nickel-chromium (NiCr), nickel and copper (NiCu), nickel chromium silicon (NiCrSi), Ni-Cr-Al (NiCrAl), Ni-Fe-Cr (NiFeCr), nickel iron cobalt (NiFeCo) Fe: iron cobalt (FeCo), ferromanganese (FeMn), iron-nickel (FeNi), iron tantalum (FeTa), Fe, and Al (FeAl), Zr (FeZr), iron tantalum chromium (FeTaCr), Sendust (FeSiAl ), iron gallium silicon (FeGaSi) Manganese alloys: manganese, nickel (MnNi), manganese iridium (MnIr), manganese platinum (MnPt), manganese palladium platinum (MnPdPt) Other alloys: molybdenum silicon (MoSi), tungsten silicon (WSi), titanium silicon (TiSi), molybdenum tungsten (MoW), tungsten titanium (WTi), cadmium telluride (CdTe), zinc Te (ZnTe) Non-metallic targets: Lithium cobalt oxide LiCoO2 (3N*4N), lithium iron phosphate LiFePO4 (3N*4N), Li3PO4 (3N*4N), Al2O3 (3N*6N), Ta2O5 (3N*4N), TiO2 (3N*4N)