タイトルまたは説明

moderate viscosity easy operation resistance to deformation good tensile strength nontoxic and durable. Features & Applications Addition cure encapsulant and potting silicone HY ***5 is addition silicone potting compound in two parts with low viscosity. It can be cured completely at room temperature. HY ***5 works on the surface of material as PC(Poly-carbonate),PP,ABS,PVC as to its superior bonding feature. It is also applicable for insulation, waterproof and bonding of electronics parts. It meets the requirements of European RoHS. Addition cure encapsulant and potting silicone Typical Application - Potting for Protetion of general electronic Module. - Outdoor protection for LED screen. Addition cure encapsulant and potting silicone TECHNICAL GUIDELINES 1, Please put part A and part B in separate container and stir evenly before mixing the two parts together. 2, Weight Ratio: part A: part B = *0:1 3, Bubble release if necessary. Deaeration the mixture under 0.*8 MPa for 3 minutes. 4,HY ***5 is cured at room temperature, so pls put it under room temperature after pouring.It comes to next process when basically cured, and it takes about *4 hours for completely cured. Kindly note: Temperature and Humidity with a tremendous influences for curing of HY **0. Datasheet of Addition cure encapsulant and potting silicone Model HY****5 Type General purpose Component A B Appearance(liquid) Gray White Mixing ratio(%) 1 1 Viscosity (Pa.s) 2.5±0.5 Pot life in *5°C(min) *0~*0 Curing time(min) **0 in *5°C or *0 in *0°C Hardness (shore A°) *5±5 Volume resistivity (?) ?1.0×***5 Dielectric constance(1.2MHz) 3.0~3.3 Dielectric strength (kv/m*1) ?*5 Temperature resistance (°C) **0~**0 Flame retardant UL**-V1 For get further information about our silicone product, PLS contact with Miss Cherry TEL: ****************4 Mobile: ***************9