タイトルまたは説明

Thermally Conductive Material
Thermally Conductive Material is developed for the radiator of electronic products which require high thermally conductive and reduce the weight more than *0% compare with the same aluminum devices.

Features
>Good thermal conductive: ***0W/mK
>Excellent thermal conductivity compared to normal
engineering plastics
>Light than normal Aluminum housing *0% in weight
>Excellent mouldability in injection moulding
>Much higher production yield than normal Aluminum Die Casting
>Excellent flexibility in designing final pruducts such as housings.
>Flame resistance, UL*4 V*0

Application
Used in applications such as Heat Sinking Housing at LED-lit BLU in LCD/LED TV and LED-lit lamps Also it can replace the normal Aluminum heat sink.
Typical Properties

Item Test method Unit KY**1 KY**2 KY**3
Physical Properties
Color Visual Black White White
Specific Gravity ASTM D**2 - 1.*8 1.7 1.6
Shrinkage % 0.*5 - 0.2 0.*5 - 0.2 0.1 - 0.3
Continuous Use Temp °C **0 to **0 **0 to **0 **0 to **0
Mechanical Properties
Tensile Strength, ASTM D**8 Kgf/cm2 **5 **0 **0
Flexural Strength ASTM D**0 Kgf/cm2 **8 **0 **0
Flexural Modulus ASTM D**0 Kgf/cm2 ****0 ****0 ****0
Impact Strength, notched ASTM D**6 Kgf.cm/cm *5 *5 *0
Electrical Properties
Volume Resistivity ASTM D**7 Ohm-meter ***0
Thermal Properties
Heat Deflection Temperature ASTM D**8 °C **5 **5 **5
Thermal Conductivity in plane Research center W/m-K *0 5 2
Thermal Conductivity through plane ( Research center W/m-K 2 5 2
Flame retardance Min. thick. 1.0mm Class V*0 V*0 V*0


Processing Date:
Injection Nominal Value Unit
Drying Temperatur e **0 °C
Drying Time **4.0 hr
Rear Temperature ******0 °C
Middle Temperature ******0 °C
Front Temperature ******0°C
Nozzle Temperature **0 ***0°C
Mold Temperature *0.0 to **0 °C
Screw Speed *0 to **0 rpm