タイトルまたは説明

Description:
The thermoformed clear conductive polyester sheet is ideal for thermoforming and vacuum forming processes to produce clear, see-through ESD safe packaging for today’s modern electrostatic sensitive microelectronics and semiconductor IC devices. The thermoformed clear conductive PET plastic sheet is made by Evervictory Acutech Corporation’s proprietary ICP surfacing technology with absolutely zero loading of carbon black and surfactants. Using our thermoform clear conductive PET sheet, the resultant ESD safe protective packaging is capable of providing permanent ESD protection at low temperatures and low RH levels. Free of contaminants, such as sloughing-off carbon black particles and migrated/aggregated hygroscopic surfactant molecules, the resultant ESD safe protective packaging will comply with ANSI/EIA standards including ANSI / ESD S*0.*0 requirements. In addition, the resultant ESD protective packaging will have the following distinct advantages:

>Surface resistance is ~*0^6 ~ *0^8 ohm at low temperatures and low RH levels,
>Water-washable, plasma and ultrasonic cleanable for cleanroom operations,
>No sloughing-off carbon black and no migration of hygroscopic surfactants,
>Excellent Scuff Resistance and antiscratch properties,
>Clear with a slight haze meaning that the protected device can be visually inspected and received directly as is giving processing advantages; and
>RoHS compliant and **0% recyclable

With the use of EAC’s proprietary ICP surfacing technology, you can now select your thermoform substrate material simply based on the optical, mechanical and physical properties of your requirements. Currently EAC delivers the following thermoform conductive plastic sheet: thermoform clear conductive polyvinyl chloride sheet, thermoform conductive polypropylene sheet and thermoform clear conductive polycarbonate sheet.

>Thermoformed Clear Conductive PET sheet,
>Thermoformed Conductive PVC (polyvinyl Chloride) sheet,
>Thermoformed Conductive PP sheet (polypropylene); and
>Thermoformed Clear Conductive PC sheet (polycarbonate)

Their respective properties are listed separately. Whether your applicable product format is ESD safe protective tray, clamshell, blister, box, tote, bin, etc., EAC will provide mold design and tooling service if requested by our clients.

Recommended field of applications:
Due to the implementation of nano-scale silicone-based IC technology and the drive for device miniaturization, modern IC chip/device/modules are more vulnerable than ever to electrostatic discharge and hence a true ESD safe protective packaging that is capable of delivering permanent ESD protection even at low temperature and low humidity environment (inside and outside of controlled environments in cleanroom) is necessary. Further, with the advance in the modern IC packaging technology like PoP, SiP and wafer-level packaging, various new format of ESD safe protective carrier might be needed for your SMT processing needs. If you are not sure of whether you should use EAC’s thermoformed clear conductive PET sheet and other thermoplastics, please consult with the specifications released by your clients or your internal packaging and processing protocols and specifications.

MEMS such as electrical compass, *-D and *-D accelerator, gyroscope, oscillator, optical switch, wafer-level packaging, optical lenses, CMOS-based IC chips and sensors, window lenses, LCD driver IC, MEMS microphones, GPS module, touch panels and touch lens, RFID module, embedded mobile DRAM module, memory module, COF device, COG device, LD sensors, hard disk drive, pressure sensors, chemical sensors, LCD glass substrate, LCD modules, precious metal and metal oxide, are the typical industries that our thermoform clear conductive PET sheet can be applied.

Still clueless? The following checklist is helpful.

>Is ANSI/EIA compliance a must at low temperatures and RH% below *0%?
>Are you looking for a cost-effective, function-oriented ESD protective packaging?
>Are you geared to reduce your packaging waste and lower your carbon emission?
>At *2% RH and *3 C, is surface resistivity between *0^6 to *0^8 ohm/square a must (EOS/ESD S*0.*0)?
>At *2% RH and *3 C, is the static decay time of less than 0.*1 sec a must (FTMS **1B, method ***6)?
>Is the oily feeling of your “antistatic tray” using antistatic surfactant additives bothering you?
>Have you ever receive complaints from your clients regarding the failure of ESD protection of your existing tray?
>Is direct visual inspection for your electrostatic sensitive IC/device/module/unit necessary?
>Is sloughing-off of carbon particles a great concern, but you can’t find one conductive ESD material that is without carbon on the market?
>Is water-cleaning, plasma cleaning, and or ultrasonic cleaning your ESD tray prior to use a must for your process?
>Do you ever wonder that “Is there a non-black conductive plastic substrate on this planet?”

If you answer “Yes” to any of the above questions, you will have to try our conductive ESD protective packaging that is designed to complete all of the above tasks. Call *@********************further information