COMMODITY:TIN INGOT *9.9%
STANDARD:BS EN *******6(GRADE DESIGNATION *9.*0)
MARK:SN*9.*0
Detailed Product Description Tin Ingot *9.*0 Sn *9.*0 Tin Ingot *9.*5 Sn *9.*5 Tin Ingot *9.*9 Sn *9.*9 1.High purity(Sn*9.*9 Sn*9.*5 Sn*9.*0), excellent weldability, good infiltration.
2.Clean, beautiful.After welding, insulation, high resistance, low ionic contamination, PCB board welding residual minimal. 3.Good oxidation resistance, low tin slag and cost savings.
4.Solder joint is bright, full and uniform.
5.Economical and can produce the lowest consumption of the solid solder joints.
 
Packaging & Delivery:Packing: *5kg/ Ingot, ***0kg/bundle in wooden case Netweight of each ingot *5kg+/*1.5kg
Each *0 ingot of tin strapped with galvanized steel belt, netweight ***0kg+/**0kg.
 
Delivery: *0days after order confirmed
 
Specification:

Purity(%)	As	Fe	Cu	Pb	Bi	Sb	Cd	Zn	Al	Total
*9.*9	0.***5	0.***5	0.***5	0.***5	0.***5	0.**2	0.***3	0.***5	0.***5	0.*1
*9.*5	0.**3	0.**4	0.**4	0.*1	0.**6	0.**4	0.***5	0.***8	0.***8	0.*5
*9.*0	0.**8	0.***5	0.**8	0.*4	0.**5	0.*2	0.***8	0.**1	0.**1	0.1

 
MAIN ELEMENTS:
EXAMINED BY SGS, TESTING REPORT NUMBER ****8/DBBPAE, 8/*2/***1
 

ELEMENTS DATA	UNIT	CONTENT	EXAMINE METHOD
TIN		*9.**9	REMAINING
SILVER			ICP
ZINC		0.**1	ICP
SULFUR		0.**2	BURNING